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Baba Farid University Dental Journal
Year : 2012, Volume : 3, Issue : 3
First page : ( 77) Last page : ( 80)
Print ISSN : 0976-8181. Online ISSN : 2230-7273.

Comparative evaluation of tensile bond strength of two recent self etch adhesives with a total etch adhesive – an in-vitro study

Singh Ripu Daman, Reader, Bal Rupam Kaur, Senior Lecturer, Khatter Ramneek, Reader, Bal C. S., Professor, Head and Principal

Address for Correspondence: Dr. Ripu Daman Singh, Department of Conservative Dentistry and Endodontics, Sri Guru Ram Das Institute of Dental Sciences and Research, Amritsar, (Punjab) India. E-mail: ripudaman100@yahoo.com

Online published on 25 November, 2013.

Abstract

Aims & Objectives

The study was conducted to investigate and compare the tensile bond strength of one (XenoV) and two-step (Adper SE Plus) self etching adhesive systems with total-etch(One step Plus)dentin adhesive system.

Materials and Methods

For dentin adhesion testing, 30 extracted teeth were ultrasonically cleaned and mounted in a ring using self-cure acrylic resin. The occlusal surface was ground until all enamel was removed in order to expose a flat dentin surface located slightly apical to the mid-coronal level. Each group (n=10) was treated with one of the above mentioned adhesives according to manufacturers instructions. A 4mm block of composite was then bonded to exposed dentinal surfaces of all the teeth which were then subjected to Instron testing machine at crosshead speed of 1mm/min. Results obtained were subjected to statistical analysis using Univariate analysis of variance and Tukey's test

Results

The results showed that the mean tensile bond strength of the samples bonded with Adper SE Plus, (self etching primer) were significantly higher (p <0.05) than One Step Plus (etch and rinse) and Xeno V (one step self etch adhesive).

Conclusion

The study concluded that Adper SE Plus showed the highest mean tensile bond strength as compared to One Step Plus and Xeno V bonding agents.

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Keywords

Hybrid layer, self-etch system, total-etch system, tensile bond strength.

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